Capabilities

Special Material

We use only high-quality materials to deliver the best product. Explore our specialized manufacturing capabilities below, and contact us with any questions.

Specialized manufacturing capabilities

  • FR-4
    • Multi-functional epoxy system
    • Our standard multilayer material
  • FR-4 / 170Tg
    • Multi-functional epoxy laminate and prepreg
    • Tg of 170°C (DSC)
    • FR-406 for applications that need a higher-temperature material
    • High yields using standard FR-4 processing
  • FR-4 / 180Tg
    • High-performance FR-4 epoxy laminate and prepreg
    • Tg of 180°C (DSC)
    • Low dielectric constant for faster signal speed and improved signal integrity
    • Recommended when layer counts exceed 8 layers
    • Higher thermal properties minimize Z-axis expansion, barrel cracking, and pad lifting in complex designs
  • JP copper-clad plated materials
  • JP aluminum-clad plated materials
  • Rigid, Rigid-Flex, and Flex
  • Rogers, Arlon, and Polyimide PCBs
  • Laser microvias
    • Both blind and buried vias
    • Controlled-depth drilling
  • High-density interconnect (HDI)
    • Extremely fine-line circuitry
    • Ultra-fine-pitch surface mount
  • RF / microwave applications
    • High-performance materials from Rogers, Taconic, and Arlon
  • Variety of surface finishes
    • OSP (Entek Plus)
    • HASL
    • Electroless Nickel / Immersion Gold
    • Electroless Nickel / Electroless Gold
  • High aspect-ratio plating up to 15:1
  • Laser skiving cover sheet for flex-circuit applications
  • Layer-count lamination up to 16 layers with controlled impedance

Have a special requirement?

Let's build your board

Tell us what you need. Our team turns your design into a high-quality printed circuit board, fast.